5G • 6G Communication
Test&Measurement
Semiconductor
Data Server
Quantum Computer
Hyprobe® Solutions
High Speed Testing Probe Pin & Socket
WithWave’s “Hyprobe® Solution” provides high-speed testing, durability, reliability, and measurement accuracy of the Device Under Test for the Probe pin and socket required during the inspection process of electronic components such as mobile phone devices • semiconductor devices, and electronic boards.
Features
• Contact resistance is controlled by operating the upper and lower contact parts independently.
• Adoption of Pin Guide Block structure optimized for Hyprobe Pin.
• Securing the stability of the socket assembly structure with precision injection molding.
Specifications
| Pad Pitch [mm] | Data Rate [Gbps] | Probe Stroke [mm] | Contact Resistance [mOhms] |
Probe Reliability | Current [A] |
|---|---|---|---|---|---|
| Over 0.3 | Min. 40 | 0.3 | Max. 100 | Min. 300 K cycle | Under 2.0 |
| Under 0.175 | Min. 30 | 0.27 | Max. 200 | Min. 300 K cycle | Max. 1.0 |
Applications
• Mobile device Test (Camera • Display modules, Touch
screen, etc)
• Semiconductor Device Test
• Board to board Interpose & Test
• Other Electronic Components.